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iCD Stackup Planner

For Engineers and PCB Designers involved in high-speed design, the iCD Stackup
Planner offers unprecedented simulation speed, ease of use and accuracy at an

affordable price

The iCD Stackup Planner features a precision 2D Boundary Element Method (BEM) Field Solver providing
customers with the accuracy and simulation speed they need for high-speed PCB Design. Seamless
integration with the Altium Layer Stack Manager, allows the transfer of substrate materials for the
correct trace impedance and automatic creation of Design Rules for differential pairs and trace routing.
Bi-directional interfaces are also available to other EDA tools.

Impedance is the key factor that controls the stability of a design - it is the core issue of the signal
integrity methodology. A properly planned PCB substrate can effectively reduce electromagnetic
emissions, crosstalk and improve signal integrity providing a low inductance power distribution network.
It can also improve the manufacturability of the product; reduce costs and increase product
performance and reliability.

Industry Leading Accuracy

• 2D (BEM) field solver precision
• Characteristic impedance, edge-coupled and broadside-coupled differential impedance
• Relative Signal Propagation with 'Matched Delay Optimization'
• iCD Termination Planner - Series Termination based on Distributed System
• iCD Materials Planner - quickly compare and select dielectric materials
• Unique field solver computation of multiple differential technologies per stackup
• Heads-up impedance plots of signal and dielectric layers
• Extensive Dielectric Materials Library - over 33,000 rigid & flexible materials up to 100GHz
• Interfaces to Allegro, Altium Designer, Excel, HyperLynx, OrCAD, PADS, ZMetrix TDR, Zuken and
IPC-2581B