10 Layer Stackup

Please modify the variables below and then click on the 'Send form' button. The trace impedance's will then be calculated.

© Copyright 1998 In-Circuit Design Pty Ltd.

10 Layer Stackup
Layer Material Type Dielectric Thickness Trace Width Cu Thickness Dielectric Constant Impedance Description
1 Conductive . .   Microstrip
  Dielectric . . . Core/Pre-preg
2 Conductive . . 1.4 .   Plane
  Dielectric . . . Core/Pre-preg
3 Conductive . .   Unbalanced Stripline
  Dielectric . . . Core/Pre-preg
4 Conductive . .   Unbalanced Stripline
  Dielectric . . . Core/Pre-preg
5 Conductive . . 1.4 .   Plane
  Dielectric . . . Core/Pre-preg
6 Conductive . . 1.4 .   Plane
  Dielectric . . . Core/Pre-preg
7 Conductive . .   Unbalanced Stripline
  Dielectric . . . Core/Pre-preg
8 Conductive . .   Unbalanced Stripline
  Dielectric . . . Core/Pre-preg
9 Conductive . . 1.4 .   Plane
  Dielectric . . . Core/Pre-preg
10 Conductive . .   Microstrip

Click here to calculate the characteristic impedance of the traces.

Note:
1. All dimensions are in MIL (thousands of an inch).
2. The Dielectric Constant of FR4 material may vary by as much as 20% (4.2 to 5.2).
3. The overall Dielectric Thickness (Cu to Cu) should total 62 MIL nominally.
4. Variables unavailable for modification have no significant effect on the impedance of the traces.